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AI/HPC Accelerators
GPU pods, tensor ASICs, high‑bandwidth memory, and interconnects.
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Flash memory prices expected to climb further soon
6+ hour, 36+ min ago (390+ words) Prices of high-capacity NOR flash memory chips are projected to increase 90 to 110 percent in the second half of this year amid growing demand and slower capacity expansion, after jumping 100 to 120 percent on average in the first half, TrendForce Corp (集邦科技)…...
SK hynix deepens TSMC logic ties as it targets 3D DRAM in South Korea
1+ hour, 36+ min ago (16+ words) CHOSUNBIZ Chosunbiz...
Samsung and Qualcomm Forge 2.1D Packaging Alliance | TechPowerUp Forums
7+ hour, 14+ min ago (19+ words) Samsung and Qualcomm Forge 2.1D Packaging Alliance techpowerup.com Automated bot check in progress Drag the handle to the target...
Transcend Launches 64 GB DDR5-6400 CUDIMM and CSODIMM Embedded DRAM Modules | TechPowerUp}
6+ hour ago (157+ words) Transcend Launches 64 GB DDR5-6400 CUDIMM and CSODIMM Embedded DRAM Modules techpowerup.com Transcend Launches 64 GB DDR5-6400 CUDIMM and CSODIMM Embedded DRAM Modules - Jan 16th 2026 NVIDIA Reportedly Ends GeForce RTX 5070 Ti Production, RTX 5060 Ti 16 GB Next (210) - Dec 31st 2025 Leaks Predict $5000 RTX 5090 GPUs in 2026 Thanks to…...
Fujitsu Launches Made-in-Japan Next-Generation CPU Fujitsu-MONAKA and Fujitsu MONAKA Server
17+ hour, 28+ min ago (276+ words) Fujitsu Limited today announced that it will begin global sales of its next-generation CPU, FUJITSU-MONAKA, designed and developed in Japan, starting November 2026. This will include sales of the processor as a standalone product to cloud and data center operators and…...
Samsung and Qualcomm Forge 2.1D Packaging Alliance
7+ hour, 14+ min ago (138+ words) TechPowerUp Samsung and Qualcomm Forge 2.1D Packaging Alliance - Jul 3rd 2026 Samsung Readies SSD 990 Value Gen 4 NVMe SSD (67) - Feb 6th 2026 NVIDIA to Use SK hynix and Samsung HBM4 for "Vera Rubin" Without Micron (7) - Sep 13th 2026 AI Firms Are Reportedly Buying NVIDIA RTX 5090 GPUs in Bulk for…...
High-end routing and aggregation equipment up 25% YoY in Q2 ⋆ Electronics Weekly
17+ hour, 21+ min ago (126+ words) High End Routing and Aggregation equipment revenue grew 25% YoY in Q2, says Dell’Oro, driven by stronger demand across all regions and customer segments. Notably, vendor direct sales revenue to cloud providers grew 94% YoY during the same quarter, driven by hyperscalers’ AI…...
SK hynix deepens TSMC ties for 3D DRAM, diverges from Samsung
12+ hour, 59+ min ago (471+ words) Hynix pursues logic-foundry DRAM approach with TSMC links while Samsung stays in-house According to the semiconductor industry on the 14th, SK hynix, at the "2026 Future Forum" held on the 8th at the Icheon Campus in Gyeonggi Province, presented as the main directions…...
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
20+ hour, 43+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
Sandisk recruits engineers in Korea as memory talent race heats up
18+ hour, 16+ min ago (147+ words) digitimes Sandisk recruits engineers in Korea as memory talent race heats up Sandisk Vice President Rajeev Nagabhirava discusses AI memory architecture at the SEMICON Taiwan 2026 Memory Summit. Credit: Sherri Wang Sandisk is making an unusual push into engineering recruitment in…...