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Packaging & Memory
Chiplets, 3D IC, HBM stacks, DDR5/PCIe lanes, and bandwidth tradeoffs.
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Fujitsu Launches Made-in-Japan Next-Generation CPU Fujitsu-MONAKA and Fujitsu MONAKA Server
16+ hour, 4+ min ago (276+ words) Fujitsu Limited today announced that it will begin global sales of its next-generation CPU, FUJITSU-MONAKA, designed and developed in Japan, starting November 2026. This will include sales of the processor as a standalone product to cloud and data center operators and…...
Samsung and Qualcomm Forge 2.1D Packaging Alliance
5+ hour, 50+ min ago (138+ words) TechPowerUp Samsung and Qualcomm Forge 2.1D Packaging Alliance - Jul 3rd 2026 Samsung Readies SSD 990 Value Gen 4 NVMe SSD (67) - Feb 6th 2026 NVIDIA to Use SK hynix and Samsung HBM4 for "Vera Rubin" Without Micron (7) - Sep 13th 2026 AI Firms Are Reportedly Buying NVIDIA RTX 5090 GPUs in Bulk for…...
SK hynix deepens TSMC ties for 3D DRAM, diverges from Samsung
11+ hour, 35+ min ago (471+ words) Hynix pursues logic-foundry DRAM approach with TSMC links while Samsung stays in-house According to the semiconductor industry on the 14th, SK hynix, at the "2026 Future Forum" held on the 8th at the Icheon Campus in Gyeonggi Province, presented as the main directions…...
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
19+ hour, 19+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
Sandisk recruits engineers in Korea as memory talent race heats up
16+ hour, 52+ min ago (147+ words) digitimes Sandisk recruits engineers in Korea as memory talent race heats up Sandisk Vice President Rajeev Nagabhirava discusses AI memory architecture at the SEMICON Taiwan 2026 Memory Summit. Credit: Sherri Wang Sandisk is making an unusual push into engineering recruitment in…...
Document: Samsung and SK Hynix rejected KEPCO's proposal to prepay ~$18.7B of chip cluster power bills, citing uncertainty over long-term chip demand
17+ hour, 51+ min ago (12+ words) Top news and commentary for technology's leaders, from all around the web....
Long Live the Short King: Why 4-hi HBM Wins
22+ hour, 29+ min ago (571+ words) This report will go through the reasoning behind what’s changed in the capacity equation, demonstrate that often HBM capacity is stranded, and show how this can be a win-win for both labs’ TCO and memory supplier profitability. HBM has been…...
Korea Moves to Localize Optical Tech for AI Data Centers
23+ hour, 44+ min ago (360+ words) Seoul Economic Daily The South Korean government is moving to localize optical communication technology for artificial intelligence data centers, or AIDCs As AI data centers grow larger, how quickly tens of thousands of graphics processing units can be connected has…...
The Local AI Hardware Trap: Why VRAM, Bandwidth, and Resale Value Matter More Than Benchmarks
1+ day, 4+ hour ago (30+ words) Local AI hardware isn’t just about VRAM or benchmark scores. Discover how memory bandwidth, power …...
South Korea's expanded espionage law takes effect amid push to protect chip technology
1+ day, 10+ hour ago (228+ words) Expenses keep rising. Build a second income with options selling. IGI operating at full capacity for scheduled flights, no diversion reported due to VVIP movements for BRICS Summit: Senior AAI official BRICS Summit 2026: Russian President Putin proposes new insurance mechanism…...